Description
- 1. Full aluminum alloy material, provide good protection for motherboard, and be good to heat dissipation.
- 2. The upper surface of the shell is designed with multiple grooves, which is more conducive to the distribution of hot air.
- 3. The CPU, RAM and other module positions are provided with silicone thermal pads to make heat dissipation more efficient.
- 4. 30*30 cooling fan provide well passive cooling. (connect to 5V and GND pin)
- 5. Applicability for Orange Pi 3 LTS