ENGINEER SWF-06 Lead Free Solder for Copper/Copper Alloy, 0.02 inch (0.6 mm) x 2.2 ft (5.6 m)

Description

• Wire diameter: 0.023 inch (0.6 mm) RPA2023NET: 10 g
• standard: JIS-AA MIL-RMA compliant RPA2023 flux content: 3.5%
• flux organic amine-type special active rodine (non-chlorine). 217. Specific Gravity: Approx. 16.4 (20 C)

Equal flaking strength to traditional co-crystal solders. Non-washable high performance resin solder.
This is an ideal resin solder that makes soldering work faster, and has no absorption and corrosion resistance to flux residue, and has excellent electrical insulation.
The resin ingredients contain no chlorine or bromine-based activators and do not require any cleaning after soldering.
For substrates in lead-free environments.

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