Hozan HS-302 Lead Free Solder, Lead Free Solder, Sn-3Ag-0.5Cu, Lead Free Solder, Wire Diameter 0.02 inches (0.6 mm), Weight: 3.5 oz (100 g)

Description

• Wire diameter: 0.02 in (0.6 mm)
• Melting Point: 217~220
• Flux: MIL-RMA grade

ESD control value: Rg<1 x 10^12
Bobbin Type: M
Solid-phase / liquid phase temperature: 45.7F (217C/220C).
Weight: 3.5 oz (100 g).
Ingredients: Sn-3Ag-0.5Cu
Wire diameter: 0.02 inch (0.6 mm)
Length: 16.9 ft (56 m) (for reference)
Quantity: 1

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