Mechanic 3D Reballing Kit For iPhone X Logic Board

Description

• Used for reballing the bottom logic board of an iPhone X ready to be re-soldered to the top board
• 3D stecils allow precise positioning of the logic board prior to reballing
• Supplied with high temperature resistant fixing station to allow a perfect finish when doing this work
• Less tendency of deformation makes its using life be longer.
• High success rate of planting tin, the solder balls can be formed once after you are proficient.

Used for reballing the bottom logic board of an iPhone X ready to be re-soldered to the top board on iPhone X 3D stecils allow precise positioning of the logic board prior to reballing also supplied with high temperature resistant fixing station to allow a perfect finish when doing this work

Shipping and Returns

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